|ME NewsWire / BusinessWire|
BALZERS, Liechtenstein - Thursday, October 3rd 2013
Oerlikon Advanced Technologies, a leading supplier of PVD deposition
equipment, has today set a new standard with the CLUSTERLINE® 300 as
the first 300mm system worldwide running thin wafer backside
metallization (BSM) for power devices in production.
Following the successful qualification by a leading power device
manufacturer, Oerlikon has received multiple orders for the
CLUSTERLINE® 300 for production of 300mm power devices.
The new developed processes for devices like Metal Oxide
Semiconductor Field-Effect Transistors (MOSFETs) offer the same
behavior as those qualified on 200mm wafers and enable power device
manufacturers to produce devices much more efficiently.
With the CLUSTERLINE® 300, Oerlikon has successfully overcome the
significant challenges associated with transitioning the
manufacturing of power devices from 200mm to 300mm on thin wafers.
The adaption of 300mm wafer production for power devices requires
innovative solutions and the addition of higher degrees of automation
and wafer handling capabilities.
Depth of experience
Over 10 years ago Oerlikon qualified the first solutions for 200mm
power device manufacturing at customer sites, and today the thin
wafer handling and processing capability of the CLUSTERLINE® 200 is
the established solution at all major power device manufacturers as
well as foundries. Oerlikon has a proven track record of overcoming
technology challenges to provide the most innovative solutions that
deliver the highest productivity and lowest cost of ownership.
Oerlikon’s long term experience with power device production
processes was a key element in achieving an accelerated qualification
and enabling the successful transition from 200mm to 300mm volume
Oerlikon’s solution for BSM applications – for example Ar/H2 etch,
AI, Ti, NiV (Ni), Ag (Au alloy) have been successfully proven in
production for extremely thin bare wafers and thin wafers on
For frontside thick Al processing the CLUSTERLINE® 300 offers
enhanced capabilities which incorporates some unique Oerlikon
developed IP. One example of this capability is the Ti/TiN Highly
Ionized Sputtering (HIS) physical vapor deposition (PVD) modules.
"We are pleased to offer customers a comprehensive solution for 300mm
power device manufacturing with the CLUSTERLINE® 300. The platform
offers both frontside thick Al and thin wafer backside metallization
(BSM) for 300mm power device manufacturing. This announcement is an
important endorsement of our solutions on 300mm from a leading power
device manufacturer. We look forward to building on this success and
continue to focus to deliver the highest productivity, best cost-
per-wafer output”, says Andreas Dill, CEO of Oerlikon’s Advanced
OC Oerlikon Management AG
Head of Group Communications & IR
T +41 58 360 96 02
F +41 58 360 98 02
Oerlikon Advanced Technologies AG
Sven E. Jarby
Head of Marketing & Communications
T +423 388 4878
F +423 388 5426